c-凯发登录

the arrayx-bob3-16p is an evaluation board allowing easy access to the signals from a sensl arrayc-30035-16p, 3mm 4x4 sipm array. see figure 7 for details on orientating the array correctly on the bob.
the breakout board has a centrally located hirose 40-way connector df17(2.0)-40ds-0.5v(57). this connector mates with the hirose df17(2.0)-40dp-0.5v(57) board-to-board connector on the arrayc-30035-16p. all signals on the array are routed via the mating connector to header pins. these pins are formed by two 20-way (10x2 row) 2.54mm pitch headers; j2 and j3.
three sma connectors and balun transformers are provided with 4-pin headers to allow any signal to be connected directly to the sma or via the transformer using jumper wires. four 7mm holes are aligned on a 25mm grid to allow mounting of the board on an optical breadboard.
评估/开发工具信息
产品 状况 compliance 简短说明 所用产品 行动
arrayx-bob3-16p-gevk active
c-array 3mm 4x4 bob

your request has been submitted for approval.
please allow 2-5 business days for a response.
you will receive an email when your request is approved.
request for this document already exists and is waiting for approval.